Our
Publications
As any academic research lab, we publish our work in high-impact journals and as conference contributions. This way, we aim to disseminate research and findings to a broad audience, trigger interaction and collaboration, and advance science and technology.
A complete overview of all our publications can be found via the database of Ghent University. Our most recent work is presented below.
Recent publications
A Novel Vectorial Unified Transform for the Full-Wave Broadband Characterization of On-chip Passives
We present a novel framework for deriving the three-dimensional (3-D) differential surface admittance (DSA) operator. The approach is based on a new unified transform method for the 3-D vector Helmholtz equation. This formulation enables a broader applicability than existing DSA
Bridging the AC Non-Equilibrium Green’s Function Formalism and Transmission Line Models for the Analysis of Nanointerconnects
The unfavorable scaling of Cu interconnects at nanoscale dimensions has prompted the search for alternative materials. To model electron transport in these novel nanointerconnects, both steady-state non-equilibrium Green’s function (NEGF) techniques and transmission line (TL) models have been employed. While
Conservative fourth-order accurate finite-difference scheme to solve the (3+1)D tilted Dirac equation in strained Dirac semimetals
Owing to their increased electron mobility compared to conventional semiconductors, three-dimensional (3D) Dirac semimetals are considered to be promising candidates for integration into next-generation electronic devices. In these materials, the low-energy dynamics of the charge carriers are governed by an
Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
In this contribution, an enhanced 3-D differential surface admittance operator is proposed, facilitating accurate modeling of piecewise homogeneous cuboidal objects. By exploiting the analytical properties of entire-domain basis functions, material interfaces are effectively eliminated from the formulation, leading to a
Broadband Electromagnetic Modeling of On-Chip Passives Using a Differential Surface Admittance Operator for 3-D Piecewise Homogeneous Structures
Accurate modeling of on-chip passive components is vital for reliable integrated circuit (IC) design. However, this is non-trivial due to the inherent heterogeneity of the structures and the wide range of material parameters involved. In this work, we present a
Spectral Bayesian Optimization Using a Physics-Informed Rational Szegö Kernel for Microwave Design
Microwave device design increasingly relies on surrogate modeling to accelerate optimization and reduce costly electromagnetic (EM) simulations. This paper presents a spectral Bayesian optimization (SBO) framework leveraging a physicsinformed Gaussian process (GP) with a rational complex-valued Szegö kernel and input