Broadband Electromagnetic Modeling of On-Chip Passives Using a Differential Surface Admittance Operator for 3-D Piecewise Homogeneous Structures
Accurate modeling of on-chip passive components is vital for reliable integrated circuit (IC) design. However, this is non-trivial due to the inherent heterogeneity of the structures and the wide range of material parameters involved. In this work, we present a single-source boundary integral equation (BIE) for modeling on-chip interconnects and passive elements. To reduce the […]