In this contribution, we investigate the radiated emission of interconnect structures in the context of electromagnetic compatibility assessment. Through the expansion of the integral operators and radiation patterns into spherical harmonics, an efficient and fast approach is derived to compute induced voltages at the receiver. The novel algorithm is applied to a microstrip interconnect with and without defective ground structure. A comparison to a full-wave solver and measurements verify the accuracy of the proposed method and showcase a speed-up with a factor 3000 as compared to the commercial solver.
Full-Wave Broadband Characterization of On-Chip Passives Subject to Etching Effects Using a Vectorial Unified Transform for Polyhedral Geometries
This paper presents a generalized formulation of the differential surface admittance (DSA) operator for three-dimensional electromagnetic analysis of arbitrary polyhedral geometries. Motivated by the increasing