Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
In this contribution, an enhanced 3-D differential surface admittance operator is proposed, facilitating accurate modeling of piecewise homogeneous cuboidal objects. By exploiting the analytical properties of entire-domain basis functions, material interfaces are effectively eliminated from the formulation, leading to a reduction in the number of unknowns without compromising the accuracy of the operator. After a […]
Broadband Electromagnetic Modeling of On-Chip Passives Using a Differential Surface Admittance Operator for 3-D Piecewise Homogeneous Structures
Accurate modeling of on-chip passive components is vital for reliable integrated circuit (IC) design. However, this is non-trivial due to the inherent heterogeneity of the structures and the wide range of material parameters involved. In this work, we present a single-source boundary integral equation (BIE) for modeling on-chip interconnects and passive elements. To reduce the […]
Differential Interconnects with Integrated Equalization and Common-Mode Filtering for Broadband Signal Integrity Enhancement in High-Speed PAM-4 Signaling
In high-speed differential interconnects on printed circuit boards, signal integrity (SI) issues arise when neglecting the inherent low-pass characteristic and ubiquitous presence of common-mode noise. This work proposes a novel open-circuited stub equalizer with integrated common-mode filter in order to compensate for the low-pass characteristic while simultaneously suppressing the transmission of unwanted common-mode noise to […]