In this contribution, we present a new approach to fully characterize interconnects composed out of arbitrary polygonal cross-sections and containing piecewise homogeneous material parameters. The complex per-unit-of-length inductance and capacitance matrices are obtained through the application of pertinent Dirichlet-to-Neumann operators, which are computed by means of an extended Fokas method, that are integrated in a boundary integral equation approach. As the complete RLGC-data of the structures under study is computed, we are able to assess relevant properties such as signal attenuation and cross-talk while the support for polygonal shapes allows for the inclusion of manufacturing effects such as etching.
Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures
In this contribution, an enhanced 3-D differential surface admittance operator is proposed, facilitating accurate modeling of piecewise homogeneous cuboidal objects. By exploiting the analytical properties