In this contribution, we present a new approach to fully characterize interconnects composed out of arbitrary polygonal cross-sections and containing piecewise homogeneous material parameters. The complex per-unit-of-length inductance and capacitance matrices are obtained through the application of pertinent Dirichlet-to-Neumann operators, which are computed by means of an extended Fokas method, that are integrated in a boundary integral equation approach. As the complete RLGC-data of the structures under study is computed, we are able to assess relevant properties such as signal attenuation and cross-talk while the support for polygonal shapes allows for the inclusion of manufacturing effects such as etching.
Bridging the AC Non-Equilibrium Green’s Function Formalism and Transmission Line Models for the Analysis of Nanointerconnects
The unfavorable scaling of Cu interconnects at nanoscale dimensions has prompted the search for alternative materials. To model electron transport in these novel nanointerconnects, both