In this contribution, we present a new approach to fully characterize interconnects composed out of arbitrary polygonal cross-sections and containing piecewise homogeneous material parameters. The complex per-unit-of-length inductance and capacitance matrices are obtained through the application of pertinent Dirichlet-to-Neumann operators, which are computed by means of an extended Fokas method, that are integrated in a boundary integral equation approach. As the complete RLGC-data of the structures under study is computed, we are able to assess relevant properties such as signal attenuation and cross-talk while the support for polygonal shapes allows for the inclusion of manufacturing effects such as etching.
A Novel Vectorial Unified Transform for the Full-Wave Broadband Characterization of On-chip Passives
We present a novel framework for deriving the three-dimensional (3-D) differential surface admittance (DSA) operator. The approach is based on a new unified transform method